Index	Abbreviation	Description	Category	Mark
3	3GPP	3rd Generation Partnership Project	HW	The original scope of 3GPP was to produce globally applicable Technical Specifications and Technical Reports for a 3rd Generation Mobile System based on evolved GSM core networks and the radio access technologies that they support both Frequency Division Duplex (FDD) and Time Division Duplex (TDD) modes). http://www.3gpp.org/
A	AC	Architecture	PM
A	APEMA	Asia Pacific Middle East and Australia	M&S	It is one of marketing area used by Philips.
A	ART	Accelerated Reliability Test	MD
A	ASE	Architecture & System Engineering	CECW
A	AVL	Approve Vendor List	S&M
B	B&W	Black & White.	HW	It is for LCD type, such as B/W, 4K color, 65K color etc.
B	BABT	British Approvals Board of Telecommunication	HW	http://www.babt.com/
B	BCA	Business Case Analysis	M&S
B	BER	Bit Error Rate	HW	It is one of key RF parameter and test items online.
B	BOM	Bill Of Material	TOP
C	CAS Form	Component Approval Submission Form	QA	It is for CECW ONLY. In Philips, CAS means Customer Approval Sample, which is expressed in qty.
C	CB	Contract Book	PM
C	CD	Component Damage	TOP	Items of defect description, incoming material issue.
C	CDMA	Code Division Multiple Access	HW
C	CE	Communaute Europeenne (French)	HW	It is French and used even by English literature now (means European community). CE mark/certification is necessary for mobile phone sales in European retail/operator channel, which include EMC, SAR and Safety.
C	CMCC	China Mobile Communications Corporation	ALL	http://www.chinamobile.com/
C	COB	Chip On Board	HW	LCD IC bonding process, include COG, COF, TAB, COB, SMT etc
C	COF	Chip On Film	HW	LCD IC bonding process, include COG, COF, TAB, COB, SMT etc
C	COG	Chip On Glass	HW	LCD IC bonding process, include COG, COF, TAB, COB, SMT etc
C	CR	Change Request	M&S	It is for CECW ONLY. In Cellon France, it is named CRF (Change Request Form) and there is a database of all CRF kept by key Account Manager.
C	CRR	Component Review Report	QA	The document is to approve that a customized part can fully meet CECW's print/specification and component implied requirements.
C	CS	Cold Solder	TOP	Items of defect description, SMT process issue.
C	CSN	Concession	ALL	In agile, we use CSN to replace LSR.
C	CSTN	Color Supertwist Nematic	HW	LCD technology
C	CTA	China Type Approval	HW
D	DAF	Drawing/Specification Agreement Form	QA
D	DCN	Design Change Notice	ALL	Initially, DCN is the design change information before SA while ECO is the one after SA, which using in CECW ONLY. Now CECW have implemented Agile (PLM system) and unified DCN & ECO to ECO. Surely, some CECW old project still follow DCN now.
D	DDD	Detail Design Document	SW
D	DFM	Design For Manufacture	TOP
D	DOE	Design of Experiment	ALL	Engineer Statistical method
D	DP	Damage Part	TOP	Items of defect description. it is visual material issue caused by production instead of incoming.